Publications

Irving, S. J., and R.A. Levy. “Triggering Mechanisms for Photoresists,” 1978. Cite
Pflug, J., and S. Irving. “FAST LSI’s Plasma Etched Dual Layer Metal Process,” 1984. Cite
Irving, S., and R. Trahan. “Sequential Plasma Etching of a Multilayer Metallization.” In ECS Extended Abstracts, 84–2:597. New Orleans, LA: ECS, 1984. Cite
Desbiens, D., and S. Irving. “Modeling of Polysilicon Films Using SUPREM III,” 1986. Cite
Irving, Scott. “Process and Device Simulation for Semiconductor Manufacturing.” Samoset Resort, Camden, Me, 1988. Cite
Irving, Scott. “Pisces Usage Notes.” TCAD Digest V2 (blog), April 1990. Cite
Guvench, M.G., S. Irving, M. Robinson, and D. Desbiens. “Concurrent Use of Two-Dimensional Process and Device Simulators in the Development of a Latch-up Free BiCMOS Process.” In University/Government/Industry Microelectronics Symposium, 1991. Proceedings., Ninth Biennial, 159–63, 1991. https://doi.org/10.1109/UGIM.1991.148142. Cite
Irving, Scott. “Electrical Calculations In Suprem4.” National Semiconductor, Santa Clara, CA, 1993. Cite Download
Irving, Scott. “Industrial Use of Device Simulation.” Stanford University, 1993. Cite
Liu, Yong, S. Irving, M. Tumulak, and E.A. Cabahug. “Assembly Process Induced Stress Analysis for New FLMP Package by 3D FEA.” In Electronic Components and Technology Conference, 2002. Proceedings. 52nd, 604–10, 2002. https://doi.org/10.1109/ECTC.2002.1008157. Cite
Liu, Yong, S. Irving, M. Rioux, A.J. Schoenberg, and D. Chong. “Die Attach Delamination Characterization Modeling for SOIC Package.” In Electronic Components and Technology Conference, 2002. Proceedings. 52nd, 839–46, 2002. https://doi.org/10.1109/ECTC.2002.1008198. Cite
Liu, Yong, and S. Irving. “Power Cycling Simulation of an IC Package: Considering Electromigration and Thermal-Mechanical Failure.” In Electronic Components and Technology Conference, 2003. Proceedings. 53rd, 415–21, 2003. https://doi.org/10.1109/ECTC.2003.1216311. Cite
Irving, S., and Youg Liu. “Wafer Deposition/Metallization and Back Grind, Process-Induced Warpage Simulation.” In Electronic Components and Technology Conference, 2003. Proceedings. 53rd, 1459–62, 2003. https://doi.org/10.1109/ECTC.2003.1216487. Cite
Liu, Yong, S. Irving, and M. Rioux. “Delamination Modeling for IC Package with Multiple Initial Cracks.” In Electronic Components and Technology Conference, 2003. Proceedings. 53rd, 1772–76, 2003. https://doi.org/10.1109/ECTC.2003.1216542. Cite
Liu, Yong, S. Irving, and T. Luk. “Thermosonic Wire Bonding Process Simulation and Bond Pad over Active Stress Analysis.” In Electronic Components and Technology Conference, 2004. Proceedings. 54th, 1:383-391 Vol.1, 2004. https://doi.org/10.1109/ECTC.2004.1319369. Cite 1
Irving, S., and Yong Liu. “Free Drop Test Simulation for Portable IC Package by Implicit Transient Dynamics FEM.” In Electronic Components and Technology Conference, 2004. Proceedings. 54th, 1:1062-1066 Vol.1, 2004. https://doi.org/10.1109/ECTC.2004.1319471. Cite
Liu, Yong, D. Desbiens, T. Luk, and S. Irving. “Parameter Optimization for Wafer Probe Using Simulation.” In Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005, 156–61, 2005. https://doi.org/10.1109/ESIME.2005.1502792. Cite
Liu, Yumin, Yong Liu, J. Yang, Qiuxiao Qian, and S. Irving. “Reliability Study of Ceramic Substrate in a SIP Type Package.” In 2005 6th International Conference on Electronic Packaging Technology, 84–87, 2005. https://doi.org/10.1109/ICEPT.2005.1564693. Cite
Liu, Yong, D. Desbiens, S. Irving, T. Luk, S. Edborg, D. Hahn, and S. Park. “Probe Test Failure Analysis of Bond Pad over Active Structure by Modeling and Experiment.” In Electronic Components and Technology Conference, 2005. Proceedings. 55th, 861-866 Vol. 1, 2005. https://doi.org/10.1109/ECTC.2005.1441373. Cite
Qian, Qiuxiao, Yong Liu, Yumin Liu, Hua Yang, and S. Irving. “TO220 Package Lead Frame Optimization for Reducing Trim and Form Delamination by Simulation.” In 2005 6th International Conference on Electronic Packaging Technology, 157–60, 2005. https://doi.org/10.1109/ICEPT.2005.1564692. Cite
Irving, S., Yong Liu, E.I.V. Almagro, and H.T. Granada. “An Effective Method for Improving IC Package Die Failure during Assembly Punch Processing.” In Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005, 227–33, 2005. https://doi.org/10.1109/ESIME.2005.1502806. Cite
Liu, Yong, S. Irving, D. Desbiens, T. Luk, N. S. How, YongSuk Kwon, and SangDo Lee. “Impact of the Die Attach Process on Power Thermal Cycling for a Discrete Style Semiconductor Package.” In Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005, 221–26, 2005. https://doi.org/10.1109/ESIME.2005.1502805. Cite
Irving, S., Yong Liu, D. Connerny, and T. Luk. “SOI Die Heat Transfer Analysis from Device to Assembly Package.” In 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006, 1–6, 2006. https://doi.org/10.1109/ESIME.2006.1643947. Cite
Yuan, Zhongfa, Yong Liu, S. Irving, and Taikun An. “Optimization of Gel and EMC for Micro Opto Coupler to Prevent Neck Crack of Gold Wire.” In 7th International Conference on Electronic Packaging Technology, 2006. ICEPT ’06, 1–4, 2006. https://doi.org/10.1109/ICEPT.2006.359768. Cite
Zhang, Zhen, Zhigang Suo, Yong Liu, S. Irving, T. Luk, and D. Desbiens. “Methodology for Avoidance of Ratcheting-Induced Stable Cracking (RISC) in Microelectronic Devices.” In Electronic Components and Technology Conference, 2006. Proceedings. 56th, 7 pp.-. IEEE, 2006. https://doi.org/10.1109/ECTC.2006.1645844. Cite
Liu, Yumin, Yong Liu, S. Irving, A. Zhu, and Xingquan Fang. “Optimization of 2 Mil Al Wire Wedge Bond of D-PAK.” In 7th International Conference on Electronic Packaging Technology, 2006. ICEPT ’06, 1–5, 2006. https://doi.org/10.1109/ICEPT.2006.359767. Cite
Qian, Qiuxiao, Yong Liu, S. Irving, Hua Yang, and Yang Zhang. “Simulation and Analysis for Lead Frame Bending Impact to Assembly Singulation Process.” In 7th International Conference on Electronic Packaging Technology, 2006. ICEPT ’06, 1–6, 2006. https://doi.org/10.1109/ICEPT.2006.359766. Cite 2
Liu, Yong, H. Allen, Timwah Luk, and S. Irving. “Simulation and Experimental Analysis for a Ball Stitch on Bump Wire Bonding Process above a Laminate Substrate.” In Electronic Components and Technology Conference, 2006. Proceedings. 56th, 6 pp.-, 2006. https://doi.org/10.1109/ECTC.2006.1645923. Cite
Liu, Yong, D. Desbiens, S. Irving, Timwah Luk, C. Lolar, Yumin Liu, and Qiuxiao Qian. “Systematic Evaluation of Die Thinning Application in a Power SIPs by Simulation.” In Electronic Components and Technology Conference, 2006. Proceedings. 56th, 9 pp.-, 2006. https://doi.org/10.1109/ECTC.2006.1645773. Cite
Zhang, Yuan Xiang, Lihua Liang, Yangjian Xia, Yong Liu, S. Irving, and T. Luk. “Highly Efficient Modeling Automation for Electronic Package Thermal Analysis.” In Electronic Components and Technology Conference, 2007. ECTC ’07. Proceedings. 57th, 1931–35, 2007. https://doi.org/10.1109/ECTC.2007.374064. Cite
Zhang, Yuanxiang, Lihua Liang, Yangjian Xia, Yong Liu, S. Irving, and T. Luk. “Modeling Automation System for Electronic Package Thermal Analysis Using Excel Spreadsheet.” In 8th International Conference on Electronic Packaging Technology, 2007. ICEPT 2007, 1–5, 2007. https://doi.org/10.1109/ICEPT.2007.4441398. Cite
Wang, Shinan, Lihua Liang, Yong Liu, S. Irving, and Timwah Luk. “Solder Joint Reliability under Electromigration and Thermal-Mechanical Load.” In Electronic Components and Technology Conference, 2007. ECTC ’07. Proceedings. 57th, 1074–83, 2007. https://doi.org/10.1109/ECTC.2007.373931. Cite
Liu, Y., Y. Liu, S. Irving, and T. Luk. “Wafer Probing Simulation for Copper Bond Pad Based BPOA Structure.” In International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007, 1–5, 2007. https://doi.org/10.1109/ESIME.2007.360035. Cite
Yuan, Zhongfa, Yong Liu, S. Irving, T. Luk, and Jiangyuan Zhang. “Thermal Numerical Simulation and Correlation for a Power Package.” In 8th International Conference on Electronic Packaging Technology, 2007. ICEPT 2007, 1–5, 2007. https://doi.org/10.1109/ICEPT.2007.4441399. Cite
Liu, Yong, S. Irving, T. Luk, Lihua Liang, and Shinan Wang. “3D Modeling of Electromigration Combined with Thermal-Mechanical Effect for IC Device and Package.” In International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007, 1–13. IEEE, 2007. https://doi.org/10.1109/ESIME.2007.360067. Cite
Wang, Qiang, Yuanxiang Zhang, Lihua Liang, Yong Liu, and S. Irving. “Anand Parameter Test for Pb-Free Material SnAgCu and Life Prediction for a CSP.” In 8th International Conference on Electronic Packaging Technology, 2007. ICEPT 2007, 1–9, 2007. https://doi.org/10.1109/ICEPT.2007.4441437. Cite
Liu, Yumin, Yong Liu, and S. Irving. “Board Level Drop Test Simulation for an Advanced MLP.” In 8th International Conference on Electronic Packaging Technology, 2007. ICEPT 2007, 1–5, 2007. https://doi.org/10.1109/ICEPT.2007.4441514. Cite
Wang, Shinan, Lihua Liang, Yuanxiang Zhang, Yong Liu, S. Irving, and T. Luk. “Electromigration Time to Failure Simulation for Solder Bumps of a Chip Scale Package.” In 8th International Conference on Electronic Packaging Technology, 2007. ICEPT 2007, 1–10, 2007. https://doi.org/10.1109/ICEPT.2007.4441511. Cite
Qian, R., Yong Liu, S. Irving, and T. Luk. “Impact of Solder Overflow and ACLV Moisture Absorption of Mold Compound on Package Reliability.” In International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007, 1–5, 2007. https://doi.org/10.1109/ESIME.2007.359956. Cite
Yuan, Zhongfa, Yong Liu, T. Luk, and S. Irving. “Influence of Heat Sink Mounting Procedure on Package Reliability.” In International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008, 1–5, 2008. https://doi.org/10.1109/ESIME.2008.4525067. Cite
Yuan, Zhongfa, Yong Liu, S. Irving, and Timwah Luk. “Identification and Verification by Experiment and Simulation for the Possibility of Die Cracking Induces by UIL Test.” In International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008, 1–5, 2008. https://doi.org/10.1109/ESIME.2008.4525065. Cite
Liu, Yumin, Yong Liu, S. Irving, and T. Luk. “Thermal Stress Simulation in the Metal-Insulator-Metal (MIM) Wafer Fabrication Process.” In Electronic Components and Technology Conference, 2008. ECTC 2008. 58th, 1067–72, 2008. https://doi.org/10.1109/ECTC.2008.4550107. Cite
Liu, Yong, S. Irving, T. Luk, and D. Kinzer. “Trends of Power Electronic Packaging and Modeling.” In Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th, 1–11, 2008. https://doi.org/10.1109/EPTC.2008.4763404. Cite
Liu, Yong, S. Irving, T. Luk, M. Rioux, and Qiuxiao Qian. “Impact of Wedge Wire Bonding and Thermal Mechanical Stress on Reliability of BPSG/Poly Layer of a Silicon Die.” In Electronic Components and Technology Conference, 2008. ECTC 2008. 58th, 1714–18, 2008. https://doi.org/10.1109/ECTC.2008.4550211. Cite
Qian, Qiuxiao, Yong Liu, T. Luk, and S. Irving. “Wire Bonding Capillary Profile and Bonding Process Parameter Optimization Simulation.” In International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008, 1–7, 2008. https://doi.org/10.1109/ESIME.2008.4525066. Cite
Zhang, Yuanxiang, Lihua Liang, Yangjian Xia, Yong Liu, S. Irving, and Timwah Luk. “Thermal Analysis Automation System for Semiconductor Package.” In International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008, 1–7, 2008. https://doi.org/10.1109/ESIME.2008.4525028. Cite
Liu, Yong., S. Irving, and T. Luk. “Thermosonic Wire Bonding Process Simulation and Bond Pad Over Active Stress Analysis.” IEEE Transactions on Electronics Packaging Manufacturing 31, no. 1 (2008): 61–71. https://doi.org/10.1109/TEPM.2007.914232. Cite
Lihua, Liang, Chen Xuefan, Wang Qiang, Liu Fei, Yong Liu, S. Irving, and Timwah Luk. “Characterization of Dynamic Behavior of Pb-Free Material 95.7Sn3.8Ag0.5Cu and Its Determination of Dynamic Constitutive Model Parameters.” In International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008, 1–5, 2008. https://doi.org/10.1109/ESIME.2008.4525027. Cite
Xia, Yangjian, Yuanxiang Zhang, Lihua Liang, Yong Liu, S. Irving, and T. Luk. “Development of Moisture Automation Analysis System for Microelectronic Packaging Structures.” In International Conference on Electronic Packaging Technology High Density Packaging, 2008. ICEPT-HDP 2008, 1–7, 2008. https://doi.org/10.1109/ICEPT.2008.4606972. Cite
Liu, Yong, T. Luk, and S. Irving. “Parameter Modeling for Wafer Probe Test.” IEEE Transactions on Electronics Packaging Manufacturing 32, no. 2 (2009): 81–88. https://doi.org/10.1109/TEPM.2009.2017514. Cite