TY - CONF TI - Thermal analysis automation system for semiconductor package AU - Zhang, Yuanxiang AU - Liang, Lihua AU - Xia, Yangjian AU - Liu, Yong AU - Irving, S. AU - Luk, Timwah T2 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008 AB - The technology of thermal analysis is very important in development of a new generation of IC package design, which aims to obtain the temperature distribution and thermal resistance of package. Most IC design engineers and package engineers have many difficulties in performing thermal analysis because they are familiar with the product structure but poor in thermal-physical modeling and FEA skills. To assist IC design engineers and package engineers to perform thermal analysis efficiently and accurately, a fully automation system (WBExcel) that has the ability to complete the whole package thermal analysis automatically has been developed based on ANSYSreg Workbench and Excel. The WBExcel consist of four modules: a Package Model Information Library, an executable Wizard System, a Package Material Library and an Environment Library. The general methodology of developing this automation system is introduced. The application on PCB level analysis and component level analysis is presented and indicates the reliability and efficiency of WBExcel. C3 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008 DA - 2008/// PY - 2008 DO - 10.1109/ESIME.2008.4525028 DP - IEEE Xplore SP - 1 EP - 7 KW - ANSYS workbench KW - Automation KW - Design engineering KW - IC design KW - IC package design KW - Integrated circuit modeling KW - Libraries KW - PCB level analysis KW - Performance analysis KW - Semiconductor device packaging KW - Temperature distribution KW - Thermal engineering KW - Thermal resistance KW - WBExcel automation system KW - Wizard System KW - environment library KW - integrated circuit packaging KW - package material library KW - package model information library KW - printed circuits KW - semiconductor package KW - temperature measurement KW - thermal analysis automation system KW - thermal-physical modeling ER -