TY - CONF TI - An effective method for improving IC package die failure during assembly punch processing AU - Irving, S. AU - Liu, Yong AU - Almagro, E.I.V. AU - Granada, H.T. T2 - Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005 AB - Singulation by a punch process is a major manufacturing step in the package assembly process. The punch process induces dynamic stress waves in the package which transfer stress to the die. This could be a potential factor to crack or pop the die during punching. The objective of this paper is to investigate an effective method to minimize stress transfer. This method uses a pre-groove technique in the lead frame design to reduce the punch stress during singulation. A 3D transient dynamic large deformation finite element method is used to determine what stresses are going to be induced during singulation of the package, to check if the package can withstand punch induced stress waves and to determine potential design weaknesses both with and without the pre-groove. Different locations of the pre-groove, different shape parameters of the groove and different punch contact shapes are simulated and studied to get the optimized results. Tests of the punching process including a group of samples with and without pre-groove have been developed. The results show that dynamic stresses transferred to die without groove are much greater than with the groove, there is an optimized shape and location of the groove that may reduce stress to a maximum degree. While changing the design of punch contact head, such as narrowing the width of contact punch head area, it also reduced the die stresses in punching singulation, but not as significantly as with pre-groove cases. Both modeling and testing have confirmed that pre-groove is an effective method to remove the die crack/pop failure. C3 - Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005 DA - 2005/// PY - 2005 DO - 10.1109/ESIME.2005.1502806 DP - IEEE Xplore SP - 227 EP - 233 KW - 3D transient dynamic large deformation KW - Assembly KW - Cities and towns KW - Cost function KW - IC package KW - Postal services KW - Semiconductor device packaging KW - Shape KW - Stress KW - Testing KW - assembly punch processing KW - circuit simulation KW - die crack KW - die failure KW - die pop failure KW - die stress KW - dynamic stress wave KW - finite element analysis KW - finite element method KW - integrated circuit modelling KW - integrated circuit packaging KW - integrated circuit testing KW - lead frame design KW - package assembly process KW - package singulation KW - pre-groove technique KW - punch contact head KW - punch stress KW - punching KW - stress effects KW - stress transfer ER -