TY - JOUR
TI - Parameter Modeling for Wafer Probe Test
AU - Liu, Yong
AU - Luk, T.
AU - Irving, S.
T2 - IEEE Transactions on Electronics Packaging Manufacturing
AB - This paper presents the simulation of parameters for wafer probe test by finite-element modeling with consideration of probe over-travel (OT) distance, scrub, contact friction coefficient, probe tip shapes, and diameter. The goal is to minimize the stresses in the device under the bond pad and eliminate wafer failure in probe test. In the probe test modeling, a nonlinear finite-element contact model is developed for the probe tip and wafer bond pad. Modeling results have shown that the probe test OT, probe tip shape and tip diameters, contact friction between the probe tip and bond pad, as well as the probe scrub of the probe tip on bond pad are important parameters that impact the failure of interlayer dielectric (ILD) layer under bond pad. Comparison between probe test damage and wire bonding failure shows the degree of damage to both probe test and wire bonding on the same bond pad structures. In addition that, a design of experiment (DOE) probe test with different ILD and metal thickness is carried. The correlation between the modeling and the DOE test is studied. The results show that the modeling solution agrees with the DOE probe test data. Modeling results have further revealed that probe test can induce the local tensile (or bending) first principal stress in ILD layer, which may be a root cause of the ILD failure in probe test.
DA - 2009///
PY - 2009
DO - 10.1109/TEPM.2009.2017514
DP - IEEE Xplore
VL - 32
IS - 2
SP - 81
EP - 88
SN - 1521-334X
KW - Finite-element analysis (FEA)
KW - bond pad stress minimisation
KW - contact friction coefficient
KW - design of experiment
KW - design of experiments
KW - diameter
KW - finite element analysis
KW - friction
KW - integrated circuit testing
KW - interlayer dielectric failure
KW - lead bonding
KW - nonlinear finite-element contact model
KW - parameter modeling
KW - probe over-travel distance
KW - probe scrub
KW - probe tip shapes
KW - tensile first principal stress
KW - wafer bonding
KW - wafer failure elimination
KW - wafer probe test
KW - wire bonding failure
ER -